Imishini yokuhlola okuzenzakalelayo

Imishini yokuhlola okuzenzakalelayo

Imishini yokuhlola ezenzakalelayo ye-AOI isetshenziselwa ukuthola ikhwalithi nokunemba kokuxhunywa kocingo lwegolide kuma-chip ahlanganisiwe. Isebenzisa okuphezulu - ukulungiswa kwamakhamera we-2D / 3D kanye nama-algorithms wesithombe se-AI ukuze asheshe futhi ahlaziye futhi ahlaziye ukuxhumana kwe-wire wire ezindlini ezihlanganisiwe
Thumela ukuPhenya
Incazelo
I-Parameters yobuchwepheshe

Isifinyezo Somkhiqizo

 

Imishini yokuhlola ezenzakalelayo ye-AOI isetshenziselwa ukuthola ikhwalithi nokunemba kokuxhunywa kocingo lwegolide kuma-chip ahlanganisiwe. Isebenzisa okuphezulu - ukulungiswa kwamakhamera we-2D / 3D kanye nama-algorithms we-ai ukucubungula ama-algorithms ukuze akwazi ukuthola ngokushesha futhi ahlaziye futhi ahlaziye ukuxhumana nge-wire wire kuma-chip ahlanganisiwe. Kungathola amapharamitha anjengesimo se-welding, isikhundla, ukuphakama, ukususwa, kanye namanye amapharamitha e-anomaling yegolide, futhi akhombe ama-anomalies ahlukahlukene noma amaphutha, adonse amandla ampofu, ukwehla, kanye nezinye izinkinga. Ngokuthola ngokushesha nokulungisa izinkinga ngokuxhumeka kwe-wire yegolide, kuyasiza ukuthuthukisa ikhwalithi nokwethenjwa kwama-chip ahlanganisiwe futhi kunciphise izinga elinephutha lama-chip.

 

AOI Gold wire bonding

I-AOI Gold Wire Wire Bonding

 

Izici zomkhiqizo

1.Gold Wire Bonding ukuhlola

Bona amapharamitha we-morphological of bonding izintambo (imvamisa igolide, ithusi noma izintambo ze-aluminium), kufaka phakathi izintambo ze-arc, ubude, isikhundla, ububanzi, ububanzi, umjikelezo omfushane nezinye iziphambeko.

 

Ukuhlaziywa kwekhwalithi ehlanganyelwe ye-2.Solder

Bheka ubuqotho bamaphoyinti oBonding (Okokuqala okuhlanganisiwe, okuhlanganisiwe kwesibili), njengokucishwa, okubandayo okuhlanganisiwe, ukungcoliswa kwe-PAD, njll.

 

3.3D ukwakhiwa kabusha kokwakhiwa kabusha

Amanye amamodeli aphezulu aphezulu {{0

 

 

Izakhiwo Zomkhiqizo

1

Uhlelo oluhlukile lwe-AoI oluhlukile no-algorithm wokutholwa usetshenziselwa isivinini esiphezulu -, okuphezulu

2

2d & 3D ngokuzithandela, ukulinganisa 3d z - ukunemba kwe-axis kuze kube ngu-8 μm

3

U-Uph: mkhulu kune- noma ulingana nama-5000pcs / h

AOI 2D Detection

I-AOI 2D ukutholwa

 

AOI 3D Detection

I-AOI 3D ukutholwa

 

Isicelo Somkhiqizo

 

● I-AOI Equipment Ukuhlola Okuqukethwe: I-wire elahlekile, ucingo olungalungile, i-wire ezindizayo, i-arc ye-arc ye-capaciall, i-capacitor ye-accuse, i-capacitor ye-adfice, i-capacitor ye-solder, i-ic elonakalisiwe I-IC, Driver Driver IC, i-Chip Ehlanganisiwe ye-Chip, Chip elonakalisiwe ye-chip elonakalisiwe, chip engcolile photosensive.

 

Imishini yokuhlola ezenzakalelayo ye-AOI iyisixhumanisi esiyisihluthulelo sokuqinisekisa ukuthembeka kwenqubo yokubopha futhi kusetshenziswa kabanzi ekuphathweni kwekhwalithi kwe-semiconductor emuva - ukuphela kokuphela. Uma udinga ikhambi elisebenza kahle, sicela uthintane ne-Huizhou Zhongke Advanced Everadic ethuthukisiwe Co, Ltd.

 

Amashadi ashisayo: Imishini yokuhlola ezenzakalelayo ye-othomathikhi, abakhiqizi bemishini yokuhlola okuzenzakalelayo okuzenzakalelayo, abahlinzeki, ifektri

Amapharamitha Ezobuchwepheshe

 

● Isixazululo: 0.5μm ~ 5μm (ngokuya ngokucushwa kwe-lens)

● Isivinini sokutholwa: Okuningana kuya kuzinqwaba zezinhlaka ngomzuzwana (ezihlobene nosayizi wenkambu yokubuka)

● Ububanzi be-wire: 15μm ~ 100μm (i-wire wire / yocingo yethusi)

● Ukuphindaphinda: ± 1μm3μm

 

Ukucaciswa komkhiqizo

 

Usayizi wangaphandle

L1000 * w800 * h1500 mm

Ukunikezwa kwamandla kagesi

2kw, AC220 V

Isisindo

I-800kg